Electrical Engineering/Compact Heatsinks Design.


Dear Prof Cleggsan

Can we design and construct compact Heatsinks for the electronic components?.


Yes, there are many geometric configurations for heat sinks and engineers are always looking for more efficient packaging.

But, the designs all must be able to dissipate the heat generated by the heat  producing components in the electronic product.  The big heat producers are IC chips, power transistors and FET devices and in some cases resistors in the power supply circuits.

Therefore, when designing an electronic product the engineer must calculate the heat dissipation from the heat producing components of the circuit and then select the heat sink that will be adequate for keeping the temperature low during the life span of the products use. It requires some testing, measurements and experience with the components being employed in the circuit designs.

Hope this helps.  

Electrical Engineering

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BSEE (Equiv) BYU BSEE University of North Dakota MSBA (MBA) Illinois State University Graduate Studies in Computer Science - Bradley University Graduate Studies - Ohio University Graduate Studies - University of Missouri Kansas City DeVry Tech - Electronics

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