Electrical Engineering/Compact Heatsinks Design.

Advertisement


Question
Dear Prof Cleggsan

Can we design and construct compact Heatsinks for the electronic components?.

Thanks
Prashant

Answer
Yes, there are many geometric configurations for heat sinks and engineers are always looking for more efficient packaging.

But, the designs all must be able to dissipate the heat generated by the heat  producing components in the electronic product.  The big heat producers are IC chips, power transistors and FET devices and in some cases resistors in the power supply circuits.

Therefore, when designing an electronic product the engineer must calculate the heat dissipation from the heat producing components of the circuit and then select the heat sink that will be adequate for keeping the temperature low during the life span of the products use. It requires some testing, measurements and experience with the components being employed in the circuit designs.

Hope this helps.  

Electrical Engineering

All Answers


Answers by Expert:


Ask Experts

Volunteer


cleggsan

Expertise

All technical areas of Electronics Engineering.

Experience

BSEE, MBA, Design, R&D, University Research.
Senior Life Member of IEEE. Life Fellow of AES.

Organizations
IEEE, Consumer Electronics Society, Audio Engineering Society.
Broad teaching experience; work experience mostly in consumer electronics and conversion from analog to digital technologies. Pioneer in digital audio at all levels.

Education/Credentials
BSEE (Equiv) BYU BSEE University of North Dakota MSBA (MBA) Illinois State University Graduate Studies in Computer Science - Bradley University Graduate Studies - Ohio University Graduate Studies - University of Missouri Kansas City DeVry Tech - Electronics

©2016 About.com. All rights reserved.